Senior Power Integrity Engineer - Lpu Packaging

NVIDIA NVIDIA · Semiconductors · Santa Clara, CA

Senior Power Integrity Engineer for LPU Packaging at NVIDIA, focusing on designing and optimizing power delivery networks from die to rack level for GPUs, HBM, and high-speed SerDes. Requires extensive experience in PI, chip-package-board PDN design, simulation, and lab validation.

What you'd actually do

  1. Define best‑in‑class power delivery design and optimization practices from die/package through board, tray, and rack levels for the full product development cycle
  2. Own the PI specification and methodology for assigned products, defining PDN targets including impedance, droop, noise, and transient response for GPU, HBM, and high‑speed SerDes
  3. Architect package‑level PDNs by collaborating with design teams on bump/ball maps, via structures, and decoupling strategies for FCBGA and 25D/3D integrations
  4. Drive system‑level PI design, including board‑level PDN planning, decap placement, and VRM interfaces while co-optimizing with SI, thermal, and mechanical teams
  5. Perform PI extraction and simulation for advanced packages and develop integrated chip–package–board co‑simulation flows using industry-standard tools

Skills

Required

  • MS or PhD in Electrical Engineering or a related field, or equivalent experience
  • 12+ years of relevant work experience in Power Integrity
  • Strong background in power integrity for high-current, low-voltage rails within large GPUs, ASICs, or CPUs
  • Proven ownership of the chip-package-board PDN design and sign-off process
  • Hands-on experience with FCBGA, 25D/3D integration, HBM, or similar high-power, high-pin-count packages
  • Direct experience in the co-design of bump/ball maps, power/ground planes, and decoupling capacitor networks
  • Proficiency with frequency-domain PDN impedance analysis and time-domain transient/droop simulation tools (eg, PowerSI, PowerDC, Sigrity, RedHawk, Totem, HFSS, SIwave, ADS, or SPICE)
  • Deep understanding of board-level PDN design, including stack-up definition, plane partitioning, and VRM placement on high-layer-count accelerator boards
  • Experience in executing lab measurements using VNAs, oscilloscopes, and PDN analyzers to correlate measured noise and droop to original specifications

Nice to have

  • Demonstrated leadership of end-to-end PI for a major GPU, CPU, or ASIC program from initial concept through mass production
  • Experience with data center or cloud hardware, specifically regarding rack-level power distribution and how PI choices impact performance headroom
  • Background in co-designing SI and PI for high-speed interfaces like PCIe, NVLink, CXL, or Ethernet SerDes to mitigate jitter and noise coupling
  • Strong communication skills with the ability to clearly explain complex PDN trade-offs and risks to both technical teams and program stakeholders

What the JD emphasized

  • Power Integrity
  • PI
  • PDN
  • chip-package-board PDN design
  • power delivery design
  • power integrity for high-current, low-voltage rails within large GPUs, ASICs, or CPUs
  • FCBGA, 25D/3D integration, HBM, or similar high-power, high-pin-count packages
  • co-design of bump/ball maps, power/ground planes, and decoupling capacitor networks
  • frequency-domain PDN impedance analysis and time-domain transient/droop simulation
  • board-level PDN design
  • lab measurements using VNAs, oscilloscopes, and PDN analyzers
  • end-to-end PI for a major GPU, CPU, or ASIC program from initial concept through mass production