Job Details:
Job Description:
The Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD: S and WA) team develops and delivers advanced substrate packaging and wafer assembly solutions for customers. As part of the Substrate Integration Group, within APTD, you will play a pivotal role in shaping the future of advanced packaging. In this role, you will:
- Work at the forefront of packaging technologies essential for next-generation AI devices;
- Collaborate with substrate suppliers worldwide to drive innovation and scalability;
- Contribute to the deployment of EMIB-T, our next-generation advanced packaging substrate technology, enabling heterogeneous chip architectures;
- Lead efforts to qualify new capacity at advanced packaging suppliers, ensuring timely readiness to meet growing customer demand.
- We are seeking highly motivated professionals with strong technical expertise who thrive on solving complex challenges, challenge conventional approaches, and build lasting supplier partnerships.
- Note: This role requires regular onsite presence to fulfill essential job responsibilities.
Key Responsibilities:
- Collaborate closely with on-site supplier engineering teams and the US integration team to advance substrate building block technologies and manage critical process interactions.
- Monitor, optimize, and improve capacity in bottleneck processes by implementing strategies that reduce throughput time (TPT).
- Oversee schedules for product and test vehicle (TV) deliveries, proactively resolving issues to achieve aggressive on-time delivery (OTD) targets.
- Conduct thorough analysis of substrate lead times, develop reduction roadmaps, and consistently meet quarterly lead time goals.
- Ensure strict adherence to Process Control System (PCS) commitments by suppliers.
- Partner with internal teams to design and execute new factory TV/product certification plans focused on yield improvement.
- Develop and maintain detailed micro-schedules for new factory startups, including milestone tracking to ensure supplier compliance with startup timelines.
- Lead qualification activities and monitor ramp indicators to guarantee smooth, incident-free production ramp-up of new capacity.
- Influence strategic decision-making at supplier management levels.
Work Environment:
- Regular travel to supplier sites and onsite presence at factories (minimum three days per week).
- Collaboration with diverse teams across Asia and the US.
- Flexibility to adapt to evolving project scopes and dynamic business needs.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
- Bachelor's or Master's degree with 8+ years, or PhD with 4+ years work experience, in Science or Engineering.
- 6+ years of experience in fab back-end or substrate manufacturing process development.
Preferred Qualifications:
- Experience in capacity management, lead time analysis, structured problem solving, situational leadership, supplier influence, and stakeholder management.
- Strong understanding of substrate process building blocks such as component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection/metrology, and electrical testing.
- Experience qualifying /owning process tools in a TD/ramp or HVM context is desired.
- Hands-on experience in factory operations, substrates, manufacturing, process engineering, and yield improvement is highly preferred.
- Fluent business-level English communication skills, excellent presentation abilities, and capability to engage effectively with supplier management.
Job Type:
Experienced Hire
Shift:
Shift 1 (Taiwan)
Primary Location:
Taiwan, Taipei
Additional Locations:
Taiwan, Hsinchu
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
- ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.