Senior System Architect, High-speed Interconnects

NVIDIA NVIDIA · Semiconductors · Yokneam, Israel +1

NVIDIA is seeking a Senior System Architect to define high-speed interconnect systems for next-generation AI platforms, focusing on terabit-per-second speeds and industry-leading power efficiency and reliability. The role involves architectural definition, technology roadmap evaluation, system co-design, and standardization leadership for NVLink and InfiniBand/Ethernet fabrics.

What you'd actually do

  1. Architectural Definition: Lead the end-to-end definition of high-speed interconnect systems for next-gen AI platforms (e.g., Rubin and beyond), focusing on 224G/448G PAM4 lanes and beyond.
  2. Technology Roadmap: Evaluate and select pioneering technologies such as Co-Packaged Optics (CPO), Silicon Photonics, and advanced OSFP/QSFP-DD form factors.
  3. System Co-Design: Collaborate with ASIC, Thermal, and PCB teams to optimize the "Silicon-to-Connector" path, minimizing insertion loss and improving signal integrity.
  4. Standardization Leadership: Represent NVIDIA in industry standards bodies (e.g., IEEE 802.3, OCP, MSA) to influence the future of high-speed connector and cable specifications.
  5. Vendor Ecosystem: Work with world-class connector and cable vendors to drive custom mechanical and electrical designs that meet NVIDIA's unique performance requirements.

Skills

Required

  • Deep understanding of Channel Operating Margin (COM), BER, FEC, and crosstalk in 112G and 224G PAM4 environments.
  • Expert knowledge of PCIe (Gen 6/7), Ethernet (800G/1.6T).
  • Sophisticated knowledge of OSFP, QSFP-DD, and SFP-DD form factors; experience with DAC, ACC, and AOC architectures.
  • Familiarity with Silicon Photonics, CPO, and MPO/APC fiber architectures.
  • B.Sc./M.Sc. or PhD or equivalent experience in Electrical Engineering, Physics, or related field.
  • 12+ years in high-speed hardware design or system architecture
  • Multi-functional Influence: Ability to align Software, Hardware, and Thermal teams on a single architectural vision.
  • Exceptional ability to present complex trade-offs to executive leadership.

Nice to have

  • Ability to predict technology bottlenecks 3–5 years in advance.

What the JD emphasized

  • proven track record of shipping high-volume data center products
  • Ability to predict technology bottlenecks 3–5 years in advance