Senior Thermal Architect - Intel Contract Employee

Intel Intel · Semiconductors · United States · Remote

This role focuses on the thermal architecture and cooling solutions for complex electronic systems, including AI/HPC platforms. The Senior Thermal Architect will define thermal budgets, lead CFD/FEA simulations, and collaborate with silicon and power teams to optimize thermal performance. Responsibilities include specifying cooling components, leading lab characterization, and mentoring junior engineers. The role requires a BS in Mechanical Engineering and 9+ years of thermal design experience, with proficiency in CFD tools and lab instrumentation. Preferred qualifications include experience with advanced cooling techniques and high-power AI/GPU/CPU thermal design.

What you'd actually do

  1. Define and own the thermal architecture for complex electronic systems (e.g., servers, consumer devices, AI/HPC platforms, EV systems - adjust to your domain).
  2. Develop thermal budgets, airflow strategies, and cooling solutions (air, liquid, two-phase, immersion, TECs, vapor chambers, heat pipes, etc.).
  3. Lead CFD and FEA thermal simulations using tools such as Ansys Icepak, FloTHERM, 6SigmaET, or COMSOL.
  4. Drive trade-off analyses between thermal performance, acoustics, cost, weight, and form factor.
  5. Partner with silicon and power teams to influence chip floorplans, package selection, and power delivery for thermal optimization.

Skills

Required

  • BS in Mechanical Engineering, Aerospace Engineering, or related field
  • 9+ years of hands-on thermal design experience for electronic systems
  • Deep expertise in heat transfer, fluid dynamics, and thermodynamics fundamentals
  • Proficiency with industry-standard CFD tools (Icepak, FloTHERM, 6SigmaET, or equivalent)
  • Strong experience with lab instrumentation: thermocouples, IR cameras, anemometers, wind tunnels, and power measurement
  • Excellent ability to communicate complex technical trade-offs to both engineers and executives

Nice to have

  • Experience with liquid cooling, two-phase cooling, or immersion cooling at rack or system scale
  • Familiarity with high-power AI/GPU/CPU thermal design (High TDP components)
  • Knowledge of acoustic design and fan curve optimization
  • Scripting experience (Python, MATLAB) for simulation automation and data analysis
  • Published papers, patents, or conference presentations (SEMI-THERM, ITHERM, InterPACK)
  • Experience leading thermal teams or technical programs

What the JD emphasized

  • Proven track record shipping products with non-trivial thermal challenges.