Overview
Microsoft Quantum is a multidisciplinary team pioneering the development of scalable quantum computing technologies to solve some of the world's most pressing challenges. We are seeking a Senior Thermal & Mechanical Engineer – Cryogenic Application-specific Integrated Circuit (ASIC) Integration to join our Quantum Systems team, focusing on the design, simulation, and testing of thermal solutions for cryogenic Complementary Metal-Oxide-Semiconductor (CMOS) integration and advanced packaging. This is a unique opportunity to shape the future of quantum computing in a dynamic, collaborative, and mission-driven environment.
At Microsoft Quantum, we aim to empower science and scientists to solve the world’s biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology. Microsoft Quantum will change the world of computing and help solve some of humankind’s currently unsolvable problems. For more information about our team, visit https://www.microsoft.com/en-us/quantum.
Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.
Responsibilities
- Drive thermal design and analysis for next-generation cryogenic CMOS systems, supporting the integration and packaging of quantum hardware modules.
- Model complex thermal loads and heat transfer mechanisms in the ultra-low temperature regime.
- Collaborate with cross-functional teams including cryomechanical engineers, quantum device designers, electrical engineers, packaging engineers, and systems architects to deliver holistic solutions for thermal management challenges.
- Design and execute experiments to validate thermal models and characterize system performance at cryogenic temperatures, including integration with custom test setups and data acquisition systems.
- Specify and evaluate materials and interface solutions that meet demanding requirements for low-temperature operation and mechanical integrity.
- Document findings, prepare technical reports, and communicate results to engineering and leadership teams.
Other:
- Embody our Culture and Values
Qualifications
Required Qualifications
Doctorate in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, Physics or related field AND 1+ years related technical engineering experience in industry
- OR Master's Degree in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, Physics or related field AND 4+ years related technical engineering experience in industry
- OR Bachelor's Degree in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, Physics or related field AND 6+ years related technical engineering experience in industry
- OR equivalent experience.
Other Qualifications
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings:
- Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
- Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. § 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation).
Ability to work in an “AI-first” environment using modern AI tools to accelerate discovery through hardware development.
Preferred Qualifications
- Doctorate in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, or Physics AND 3+ years related technical engineering experience OR Master's Degree in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, or Physics AND 6+ years related technical engineering experience OR Bachelor's Degree in Mechanical Engineering, Thermal Engineering, Applied Physics, Materials Science, or Physics AND 8+ years related technical engineering experience OR equivalent experience.
- 4+ years of hands-on experience in solid-state thermal modeling, simulation, and testing, particularly in research and advanced product development settings.
- 4+ years experience with thermal simulation software (such as ANSYS, COMSOL Multiphysics, SolidWorks Simulation or equivalent).
- 4+ years experience with cryogenic ASIC integration and packaging.
- Proficient with quantum hardware platforms and requirements for solid-state quantum systems.
- 4+ years experience with cryogenic hardware platforms, such as cryostats and dilution refrigerators, emphasizing solid-state thermal conduction.
- Ability to lead experimental design, instrumentation, and analysis for thermal measurements in solids at ultra-low temperatures.
- Proficient communication and documentation skills, with a track record of technical leadership.
- Committed to mentor junior engineers and collaborate effectively across interdisciplinary teams.
- Proficient understanding of conduction and solid-state heat transfer physics at cryogenic temperatures.
- Proven ability to lead experimental design, instrumentation, and analysis for thermal
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Quantum Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800 - $234,700 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $158,400 - $258,000 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about **requesting accommodations.**