Senior Tpu Rtl Design Engineer, Networking, Inter-chip Interconnects

Google Google · Big Tech · Sunnyvale, CA +1

This role focuses on the design and development of RTL IP for high-speed interconnect subsystems within Google's next-generation Tensor Processing Units (TPUs). The engineer will be responsible for the microarchitecture, RTL execution, and ensuring the functional correctness of these components, which are critical for AI and machine learning workloads in data centers. The role involves close collaboration with system architects, software/firmware teams, verification teams, and physical design teams to meet stringent power, performance, and area goals.

What you'd actually do

  1. Lead the microarchitecture and RTL execution to deliver high-performance network design components which meet strict power, performance and area (PPA) goals and satisfy established coding and quality guidelines.
  2. Collaborate with system architects and software/firmware teams to ensure alignment between system and IP requirements.
  3. Own the complete RTL lifecycle from initial microarchitecture, coding and documentation to ensuring sign-off readiness for Lint, CDC, and synthesis.
  4. Collaborate with the Verification team to develop test plans, debug RTL, and ensure functional correctness.
  5. Work closely with the Physical Design team to meet timing, area, power, and manufacturability requirements.

Skills

Required

  • high-performance ASIC design
  • architecting or designing RTL solutions for digital systems
  • high-speed interconnects
  • developing networking IP across one or more layers

Nice to have

  • Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture
  • 7 years of experience in high-performance ASIC design
  • Experience with IEEE networking standards and applications
  • Experience with scripting languages (e.g., Tcl, Python or Perl)
  • Familiarity with one or more industry-standard tools for CDC, RDC, RTL Linting, or LEC
  • Understanding of digital design fundamentals, including synchronous and asynchronous logic, state machines, and bus protocols

What the JD emphasized

  • custom silicon solutions
  • AI hardware
  • high-speed interconnects
  • networking IP

Other signals

  • TPU design
  • AI hardware acceleration
  • inter-chip interconnects
  • ASIC/SoC hardware for AI accelerators