Senior Yield Enhancement Engineer

Cerebras · Semiconductors · Headquarters +1 · Silicon

Senior Yield Enhancement Engineer role at Cerebras, focusing on semiconductor testing, failure analysis, and yield improvement for their AI chip. The role involves analyzing ATE data, developing failure analysis tools, and collaborating with various engineering teams to enhance testability and yield. While the company builds AI chips and the role touches AI applications, the core craft is semiconductor engineering and testing, not direct AI/ML model development.

What you'd actually do

  1. Analyze ATE data logs, Shmoo plots, parametric characterization data, and spatial wafer defect patterns.
  2. Develop failure analysis tools using optical, photo emission, and laser-based defect localization techniques specific to Cerebras hardware.
  3. Develop and execute FIB (Focused Ion Beam) edit plans for Silicon root cause validation.
  4. Communicating with OSATs and Fab to drive production testing in HVM environment.
  5. Understand DFT strategies including hierarchical scan chains, distributed BIST, SRAM test methodologies, and perform diagnosis on ATE data.

Skills

Required

  • Bachelor's or Master's degree in Electrical Engineering / Computer Engineering, or related field
  • 7+ years of hands-on experience in semiconductor test engineering/ FA/ Yield Enhancement
  • Hands-on experience with lab debug tools including Oscilloscopes (high-speed probing and signal integrity), wafer probe stations, probe cards, Keyence/Optical inspection systems, and advanced imaging techniques
  • Failure analysis (FA) expertise including use of optical probing tools, physical inspection workflows, and correlation of electrical failures to physical defects
  • Strong capability to read and understand Digital CMOS layouts, power grids, routing structures and SRAM arrays
  • ATE test program debugging, and yield improvement experience
  • Good interpersonal skills
  • Proven track record of working cross-functionally, learning fast, and driving issues to closure
  • Working knowledge of git repositories, GitHub, git actions/Jenkins, merge and release flows
  • Proficiency in programming languages: Python, C/C++, Perl for large-scale data analysis

Nice to have

  • Develop fault isolation techniques using OBIRCH/IREM/LADA optical techniques
  • Experience with advanced test data analysis tools and machine learning techniques for yield optimization
  • Familiarity with advanced packaging technologies for wafer-scale systems (TSV, advanced interconnects)
  • Familiarity with in-line testing and diagnostics using CPU memory and execution with self-checking
  • Knowledge of chip defect profiles and mitigation strategies across manufacturing steps

What the JD emphasized

  • 7+ years
  • Semiconductor Testing/Failure Analysis/Yield Enhancement
  • ATE datalogs
  • defects in detail
  • disposition wafers
  • FA/Yield enhancement
  • physical/optical inspection techniques
  • testing, characterization of silicon defects
  • failure modes
  • end-to-end solutions
  • chip design, fabrication, validation, production, and manufacturing
  • ATE data logs
  • Shmoo plots
  • parametric characterization data
  • spatial wafer defect patterns
  • failure analysis tools
  • optical, photo emission, and laser-based defect localization techniques
  • FIB (Focused Ion Beam) edit plans
  • Silicon root cause validation
  • OSATs and Fab
  • production testing
  • HVM environment
  • DFT strategies
  • hierarchical scan chains
  • distributed BIST
  • SRAM test methodologies
  • diagnosis on ATE data
  • DFT engineers
  • silicon architects
  • designers
  • performance teams
  • software engineers
  • testability and yield
  • test programs
  • di/dt behavior
  • voltage-frequency characterization space
  • current limits
  • thermal constraints
  • ATE logs
  • disposition learnings
  • Python scripts
  • UNIX environment
  • Electrical Engineering / Computer Engineering
  • hands-on experience in semiconductor test engineering/ FA/ Yield Enhancement
  • lab debug tools
  • Oscilloscopes
  • high-speed probing
  • signal integrity
  • wafer probe stations
  • probe cards
  • Keyence/Optical inspection systems
  • advanced imaging techniques
  • Failure analysis (FA) expertise
  • optical probing tools
  • physical inspection workflows
  • correlation of electrical failures to physical defects
  • Digital CMOS layouts
  • power grids
  • routing structures
  • SRAM arrays
  • ATE test program debugging
  • yield improvement experience
  • interpersonal skills
  • standout colleague
  • problem solver
  • cross-functionally
  • learning fast
  • driving issues to closure
  • git repositories
  • GitHub
  • git actions/Jenkins
  • merge and release flows
  • streamline test and release
  • Python
  • C/C++
  • Perl
  • large-scale data analysis
  • fault isolation techniques
  • OBIRCH/IREM/LADA optical techniques
  • advanced test data analysis tools
  • machine learning techniques for yield optimization
  • advanced packaging technologies
  • wafer-scale systems
  • TSV
  • advanced interconnects
  • in-line testing and diagnostics
  • CPU memory and execution with self-checking
  • chip defect profiles
  • mitigation strategies
  • manufacturing steps