Sr. Manager Packaging Engineering

AMD AMD · Semiconductors · MARKHAM, Canada · Engineering

This role leads the design execution of next-generation Data Center GPU and MI programs, focusing on high-performance package designs. It involves leading cross-functional teams, driving operational excellence, and scaling execution using automation and AI-enabled methodologies. The role also includes team leadership, development, and process innovation, with a preference for experience in AI/ML applications within engineering workflows.

What you'd actually do

  1. Lead end-to-end execution of multiple Data Center GPU / MI package design programs, ensuring schedule, quality, and cost targets are consistently met.
  2. Lead, mentor, and grow a high-performing team of package design engineers across geographies.
  3. Define and drive improved design methodologies, workflows, and best practices to enhance execution efficiency.
  4. Champion adoption of AI/ML-enabled tools and automation (e.g., layout optimization, design rule checking, predictive analytics) to improve productivity and decision-making.
  5. Collaborate with silicon, SI/PI, thermal, mechanical, and manufacturing teams to ensure design convergence.

Skills

Required

  • Experience in semiconductor package design
  • Proven experience leading teams and executing multiple concurrent complex projects in fast-paced environments
  • Strong understanding of package layout, high-speed design considerations, and multi-die integration
  • Excellent leadership, communication, and stakeholder management skills
  • Demonstrated ability to handle ambiguity, drive decisions, and deliver under pressure
  • B.S. or higher in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field

Nice to have

  • Experience with AI/ML applications in engineering workflows (design automation, data analytics, optimization)
  • Experience working with OSATs, substrate vendors, and manufacturing partners
  • Hands-on experience with industry tools such as Synopsys 3DICC, Cadence SiP / APD or equivalent
  • Experience in Data Center GPU, HPC, or advanced packaging technologies (e.g., chiplets, 2.5D/3D integration)

What the JD emphasized

  • AI/ML-enabled tools and automation
  • AI/ML applications in engineering workflows