Sr. Mechanical Engineer, Annapurna Labs, Machine Learning Hardware

Amazon Amazon · Big Tech · Austin, TX · Hardware Development

This role is for a Sr. Mechanical Engineer focused on the design and optimization of hardware, specifically custom chips and accelerators for machine learning in Amazon's data centers. While the hardware supports ML, the core craft of the role is mechanical and thermal engineering, not AI/ML model development.

What you'd actually do

  1. As a Thermal/Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure.
  2. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing.
  3. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.
  4. Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
  5. Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization

Skills

Required

  • BS or MS degree in Mechanical/Thermal Engineering
  • 10+ years industry experience in Mechanical and Thermal design of Systems
  • Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
  • 3+ years of experience SoC Thermal modelling and IC package transient thermal response
  • Experience with Chip package, System Mechanical & Thermal design for air-cooled and liquid-cooled systems
  • Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
  • Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization

Nice to have

  • Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
  • Tool Familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
  • Programming experience: Bash script, Shell script, Linux, Python, and Lua. Familiarity with working in Linux environment is an added advantage
  • Working knowledge on fans, valves, chillers, and CDUs
  • Knowledge of various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies
  • Develop detailed CFD and compact RC models for SoC and Package thermal analysis
  • Knowledge of hardware and software based thermal / power management control algorithms
  • Optimize thermal solutions under PPA and system design constraints
  • Simulate and prototype thermal control strategies
  • Validate thermal models through power/thermal measurements on Hardware

What the JD emphasized

  • 10+ years industry experience in Mechanical and Thermal design of Systems
  • 3+ years of experience SoC Thermal modelling and IC package transient thermal response