Sr Principal Engineer Microelectronic Semiconductors

Northrop Grumman Northrop Grumman · Aerospace · Elkridge, MD +1 · Electrical

Northrop Grumman is seeking a Principal Engineer/Sr. Principal Engineer for their Manufacturing organization in Elkridge, MD. The role involves developing, maintaining, and improving manufacturing processes for microelectronics, including die, BGAs, and interposers. Responsibilities include specifying and procuring equipment, developing process documentation, supporting manufacturing builds, monitoring yields and costs, solving manufacturing problems, and assisting with training. The role also supports design and engineering by recommending product design improvements for advanced microelectronics and participating in design reviews. The position can be filled at either a Level 3 or Level 4, with specific experience requirements for each.

What you'd actually do

  1. Developing new and maintaining, or improving, existing manufacturing processes with a focus on production capabilities and affordability
  2. Support manufacturing of micro electronics including: Die, BGAs and interposers.
  3. Monitoring process yields and cost, recommending and implementing quality improvements to drive improved metrics.
  4. Solving of manufacturing problems (related to materials, designs, equipment and tooling, training and instructions) to support production.
  5. Recommending product design improvements required to produce advanced microelectronics products.

Skills

Required

  • Bachelors degree in a STEM major and 5+ years relevant manufacturing circuit card assembly environment, or Masters degree and 3+ years relevant manufacturing circuit card assembly environment experience (Level 3)
  • Bachelors degree in a STEM major and 8+ years of relevant manufacturing circuit card assembly environment, or Masters degree and 6+ years relevant manufacturing circuit card assembly environment (Level 4)
  • U.S. citizenship
  • Ability to obtain and maintain a U.S. Government security clearance

Nice to have

  • Experience using J-STD-001 and IPC/MIL-STDs standards in manufacturing.
  • Familiarity with Fuzion and Mycronic Pick and Place Machines, Screen Printers, SPI concepts and X-Ray.
  • Skilled in component packaging requirements.
  • Demonstrate engineering leadership & teamwork capabilities, interpersonal communication skills, and activities (professional/community/extracurricular)
  • Experience in developing and delivering presentations and leading small and large groups
  • Experience in working on business or engineering full life-cycle projects from inception through launch.
  • Experience working through root cause and corrective action activities.
  • Demonstrate engineering technical leadership in a field.
  • Experience in working in an autonomous work environment on complex projects.
  • Experience in a PCCB process culture
  • Successful track record of mentorship and guidance of early career engineers

What the JD emphasized

  • manufacturing circuit card assembly environment