Staff Electromechanical Design Engineer

Northrop Grumman Northrop Grumman · Aerospace · Baltimore, MD +1 · Electrical

Staff Electromechanical Design Engineer responsible for the design, prototyping, and production support of RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs). Requires collaboration within a cross-functional team, technical leadership, and mentoring. Must have experience with PWB/CCA design, signal routing, chip-scale packaging, and substrate/PWB layout, along with proficiency in design tools like AutoCAD and Xpedition.

What you'd actually do

  1. Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
  2. Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
  3. Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints.
  4. Providing technical leadership and mentoring to less experienced personnel.

Skills

Required

  • Bachelor’s degree with 12 years of experience, a master’s degree with 10 years of experience or a PhD with 8 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.; will consider 4 years of applied experience in lieu of degree requirement.
  • U.S Citizenship required.
  • The ability to obtain/maintain an active DoD Secret clearance
  • Experience with PWB/CCA design and signal routing, including chip-scale packaging technologies and substrate\PWB layout
  • Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
  • Proficient with AutoCAD and/or Xpedition software
  • Familiarity with NX or other 3D modeling software

Nice to have

  • Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
  • A current/active DoD Secret Clearance or higher
  • Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
  • Familiarity with thermal and structural analysis considerations, methodologies, and software tools
  • Experience with hands-on assembly and testing of prototype electronic hardware
  • Experience in a technical leadership role on a cross-functional product development team
  • Experience routing RF signals

What the JD emphasized

  • Secret Clearance
  • DoD Secret Clearance