Subject Matter Expert Electronics Design and Analysis Engineer (electronic Packaging Design)

Boeing Boeing · Aerospace · El Segundo, CA

Boeing is seeking a Subject Matter Expert Level Space Electronics Packaging and Mechanical Product Design and Analysis Engineer to join their team in El Segundo, CA. The role involves full cradle-to-grave work including mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis for satellite missions. Responsibilities include leading multi-discipline groups, performing trade studies, detailed structural and thermal analysis, collaborating with Electrical Engineering on PCB design, validating designs, developing new processes, conducting Root Cause and Corrective Action, tracking technical performance measures, and supporting supplier management. The position requires a Bachelor's degree in a STEM field, 9+ years of CAD experience, and experience in either thermal/structural/dynamics/vibration analysis or PCB design/assembly. A US Security Clearance is required.

What you'd actually do

  1. Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements.
  2. Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements.
  3. Performs detailed structural and thermal analysis using hand calculations and analysis tools.
  4. Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level.
  5. Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs).

Skills

Required

  • Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science
  • 9+ years experience using Computer-Aided Design (CAD) tools
  • Experience with thermal, structural, dynamics, and/or vibration analysis and tools OR Experience with Printed Circuit Boards (PCB) design or assembly
  • Ability to obtain a US Security Clearance

Nice to have

  • Active Secret clearance
  • Experience within aerospace or related industry or with space electronics
  • Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics
  • Excellent oral and written communication skills and ability to communicate across multiple disciplines with internal and external customers
  • Skill and ability to collect, organize, synthesize, and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources
  • 3+ years experience leading teams on complex projects
  • Level 4: 9 or more years' related work experience or an equivalent combination of technical education and experience

What the JD emphasized

  • US Security Clearance
  • US Citizenship