System Signal Integrity & Power Integrity Engineer (si/pi)

Cerebras · Semiconductors · Headquarters +1 · Systems

Seeking an experienced System Signal Integrity and Power Integrity Engineer to solve complex integrity challenges in next-generation AI compute systems, focusing on high-speed interfaces, power delivery networks, and advanced packaging.

What you'd actually do

  1. Solve complex signal integrity and power integrity problems for high‑speed AI compute platforms, including chip‑to‑chip and chip‑to‑board interfaces.
  2. Perform advanced pre‑layout and post‑layout SI/PI analysis across PCBs, flex circuits, rigid‑flex assemblies, connectors, and advanced packages.
  3. Lead root‑cause analysis of challenging SI/PI issues such as margin shortfalls, impedance discontinuities, coupling, resonances, and simulation‑to‑hardware mismatches.
  4. Analyze and resolve SI/PI challenges associated with flex circuits, high‑speed flex connectors, interposers, and advanced packaging technologies.
  5. Analyze and troubleshoot power delivery networks using DC and AC simulations and hardware correlation to resolve performance and stability issues.

Skills

Required

  • Master’s degree in Electrical Engineering
  • 10+ years of demonstrated depth of expertise in system-level signal integrity and power integrity engineering for high‑speed hardware systems
  • Deep expertise in high‑speed serial and parallel interface analysis and debug
  • Strong hands‑on experience with PCB, rigid‑flex, and flex circuit stack‑up design and analysis
  • Advanced SI/PI analysis of flex connectors, high‑density interconnects, and advanced packaging technologies
  • Proficiency with 2D and 3D electromagnetic simulation tools
  • Power delivery network analysis, simulation, and lab correlation at the system level
  • Strong grounding in transmission line theory, microwave engineering, and high‑speed design fundamentals
  • Proven ability to correlate simulation results with hardware behavior and drive concrete design fixes

Nice to have

  • Experience with large‑scale AI or high‑performance compute systems

What the JD emphasized

  • high-speed
  • AI compute systems
  • advanced packaging