Technical Program Manager - Sensing

Apple Apple · Big Tech · Cupertino, CA +1 · Operations and Supply Chain

Technical Program Manager for Sensing at Apple, focusing on manufacturing process, yields, and factory readiness for mass production of high-volume consumer electronics. Requires deep technical understanding of manufacturing, process integration, failure analysis, and quality methodologies. The role involves working with cross-functional teams to ensure product quality and drive operational excellence across the product life cycle.

What you'd actually do

  1. Provide total ownership of the factory output, yield, quality and readiness to ramp volume.
  2. Drive lessons learned into designs and use predictive methods to anticipate and avoid quality issue early in development cycle. Maintain open issues and resolve prior to mass production.
  3. Provide leadership and drive yield & operational excellence expectations with CMs through direct interaction, continuous communication, and continuous improvement efforts.
  4. Select best in class equipment efficiencies, UPH, MMR, and material usage, and drive + implement across vendors
  5. Drive continuous yield improvement activities with CMs.

Skills

Required

  • Engineering or related field
  • Technical support of high-volume consumer electronics
  • Wafer level, component, PCBA, module assembly, test, pack-out processes, and process integration
  • Factory processes
  • Quality methodologies
  • Process capability statistical analysis
  • DOE
  • FMEA
  • SPC
  • Failure analysis
  • Data analysis
  • Justification of specifications
  • Tolerance stack ups
  • Structured problem-solving methodology
  • Root cause analysis
  • Corrective and preventative actions
  • Communication
  • Leadership
  • Complex or ambiguous situation analysis
  • Independent judgment
  • Network creation
  • Action plan development
  • Debugging
  • Technical findings presentation
  • Executive leadership communication

Nice to have

  • Masters in Engineering or related field
  • PhD
  • Injection molding
  • Stamping
  • Plating
  • Micro-machining
  • Thin film coatings
  • Lens assembly
  • Lamination processes
  • Sensing modules
  • ARVR modules
  • Product design
  • JMP
  • Tableau
  • Six Sigma methodologies
  • Project/program management
  • Planning
  • Cost management
  • Delivery management
  • Risk analysis
  • Working in a complex organization

What the JD emphasized

  • Bachelor's degree in Engineering or related field
  • 12+ years of experience providing technical support of high-volume consumer electronics
  • Proven technical skills, including experience and thorough understanding of wafer level, component, PCBA, module assembly, test, pack-out processes, and process integration
  • Hands-on in the factory processes, with frequent time spent on the factory floor
  • In-depth knowledge in quality methodologies with common tools, including process capability statistical analysis
  • Skilled in DOE, FMEA, SPC, failure analysis, data analysis, and justification of specifications
  • Understand tolerance stack ups for assemblies and part level
  • Excellent problem solver, using structured problem-solving methodology to assign root cause, plus develop and implement corrective and preventative actions
  • Excellent interpersonal skill required, and the ability to concisely understand and communicate issues, and lead the team to a solution
  • Works on significant and unique issues where analysis of situation or data requires an evaluation of intangibles
  • Experience analyzing complex or ambiguous situations and exercising independent judgment to drive results
  • Creates formal networks involving coordination among groups
  • Strong communicator who can translate high-level goals into tangible action plans
  • Expert level de-bugging skills. Must have proven ability to tackle problems under tight time constraints
  • Experience presenting technical findings, recommendations, and corrective action plans to executive leadership