Wafer Packaging Manufacturing Us/eur Sort Leader

Intel Intel · Semiconductors · New Mexico, Albuquerque, United States +1

Lead Wafer Packaging Manufacturing (WPM) Sort factories in the US and Europe regions, responsible for E-Test, Wafer Sort, and Die Sort. Manage a team of managers, engineers, and technicians, driving continuous improvement in safety, quality, output, and cost. Ensure compliance with safety and environmental regulations, meet quality goals, and own output commits. Lead technical problem-solving and implement root cause solutions for process and tool issues. Manage process transfers and maintain process synchronization across Sort floors.

What you'd actually do

  1. Manage and lead a team of managers, module engineers, and technicians. Set priorities and strategy for this Sort team.
  2. Drive continuous improvement in safety, quality, output, and cost across Sort factories in WPM.
  3. Meet safety and environmental compliance for tools and processes in scope.
  4. Own output commits for these factories in conjunction with the WPM Production team.
  5. Lead technical problem-solving: Collaborate with cross-functional team leaders to develop and implement systems and processes that ensure troubleshooting efforts to permanently and systemically resolve complex process and tool issues.

Skills

Required

  • leadership experience in the semiconductor industry
  • first or second level management
  • problem-solving tools
  • factory process control systems and methodologies
  • semiconductor wafer/die tool and process technology

Nice to have

  • wafer and/or die testing (E-Test, Sort, Class) tools and process and sort product engineering
  • process and product transfers and volume ramps
  • Management of equipment sustaining technicians in a production environment
  • making organizational transformations

What the JD emphasized

  • 10+ years of leadership experience in the semiconductor industry
  • 5+ years as first or second level management
  • A detailed understanding of problem-solving tools as well as factory process control systems and methodologies.
  • Working knowledge of semiconductor wafer/die tool and process technology.