Wire Bonding Technician

Anduril Anduril · Defense · Lexington, MA · Mission Systems : Imaging Engineering : Imaging - Microelectronics

This role is for a Micro-electronics Technician focused on packaging and assembly of custom infrared image sensors for a defense technology company. Responsibilities include handling and testing silicon wafers, wire bonding image sensors, performing inspections, and operating test equipment to collect image data in a cleanroom environment. The company utilizes an AI-powered operating system and develops technologies like autonomy, AI, computer vision, sensor fusion, and networking.

What you'd actually do

  1. Work with engineers to package, test and assemble custom infrared image sensors in a clean room environment.
  2. Handle and test silicon wafers in automated probe test station.
  3. Handle, mount, and wirebond image sensors into custom ceramic packages using a wire ball bonder.
  4. Visual and electrical inspection of fully packaged sensor chip assemblies (SCAs).
  5. SCA installation into liquid nitrogen high vacuum test station.

Skills

Required

  • Experience working with precision test and measurement equipment for development or production hardware.
  • Experience collecting data from devices under test (DUTs) using test and inspection equipment.
  • Experience working with delicate hardware such as microelectronics assemblies and performing ultra fine motor skill tasks.
  • Eligible to obtain and maintain an active U.S. Secret security clearance

Nice to have

  • Prior experience working within a clean room environment.
  • Experience with microelectronics packaging such as wirebonders.
  • Experience with electrical cabling assemblies, soldering, crimping and debug.
  • Proficiency with SolidWorks and scripting/automation languages (MATLAB, Python, LabVIEW).

What the JD emphasized

  • U.S. Secret security clearance