AMD currently has 35 active AI-related job listings. The majority of these roles, 66%, are focused on serving infrastructure. Engineering is the dominant function, with 32 positions. Frequent technical tags include model_serving, inference_infra, and evals, suggesting a focus on the deployment and evaluation of AI models. In the last 30 days, AMD posted 37 new AI roles.
AMD currently has 62 active AI-related roles in our index. The most common open titles are: DC-GPU Performance Modeling Engineer (3), Data Center Engineer (2), Lead Packaging Automation Engineer (2), 3D IC and ADVANCED PACKAGING CAD ENGINEER , AI Framework Engineer. Most positions are in Engineering and Research.
AMD's active AI hiring is concentrated in: serving infrastructure (73%), agents (13%), application (6%). These categories follow a seven-stage AI lifecycle: data, pre-training, post-training, serving infrastructure, agents, evaluation, and application.
AMD is hiring AI talent in: United States (27 roles), India (13 roles), China (7 roles), Canada (6 roles).
Job postings at AMD most frequently mention: GPU Computing, Computer Architecture, Compiler Design, Python, Performance Profiling.
In the past 30 days, AMD has posted 50 new AI-related roles. That is a -28% change versus the prior 30 days (69 → 50).
| Title | Stage | AI score |
|---|---|---|
| 3D IC and ADVANCED PACKAGING CAD ENGINEER This role focuses on integrating AI and ML capabilities into CAD and EDA workflows for 3D-IC and advanced packaging design. The engineer will develop and deploy agentic AI systems, LLM-assisted automation, and ML-based optimizations to improve design quality of results (QoR) in areas like timing, area, and performance. The role requires a strong silicon hardware design background, software/scripting proficiency, and hands-on experience applying AI to CAD/EDA problems. | Agent | 7 |
| Lead Packaging Automation Engineer This role focuses on developing and deploying AI-assisted workflows and automation for advanced packaging design in the semiconductor industry. The Lead Packaging Automation Engineer will optimize design stages using AI/ML, transition to agentic design models, and build closed-loop optimization systems. | Agent |
| 7 |