Chiplet Physical Design Engineer

Tenstorrent · Semiconductors · Austin, TX · Architecture

Tenstorrent is seeking a Senior Chiplet Physical Design Engineer to design and integrate chiplets into a System-in-Package (SiP) for AI silicon. The role involves synthesis, place-and-route, and timing closure for high-speed CPU cores on advanced process nodes, collaborating with global teams and external partners.

What you'd actually do

  1. own critical aspects of synthesis and place-and-route for high-speed CPU core designs, contributing directly to performance, power, and area outcomes on advanced process nodes
  2. designing and integrating multiple chiplets into a System-in-Package (SiP)
  3. collaborate closely with Tenstorrent experts and leaders across the USA, Japan, and other global sites, as well as external partners, to deliver world-class CPU and AI silicon
  4. work on a high-profile, cutting-edge program

Skills

Required

  • Physical design for CPU or GPU products
  • Synopsys and/or Cadence tools (synthesis, P&R, closure)
  • Timing closure
  • ECO flows
  • PV convergence
  • TCL scripting
  • Electrical Engineering, Computer Engineering, or Computer Science degree
  • 10+ years of industry experience

Nice to have

  • Python or similar scripting
  • experience at advanced nodes (3nm and below)
  • multi-GHz designs

What the JD emphasized

  • 10+ years of industry experience in physical design for CPU, or GPU products
  • Bachelor’s, Master’s, or PhD in Electrical Engineering, Computer Engineering, or Computer Science
  • strong hands-on experience with Synopsys and/or Cadence tools across synthesis, P&R, and closure
  • proven expertise in timing closure, ECO flows, and PV convergence at block and chip level
  • TCL required
  • eligible to access U.S. export-controlled technology