High Speed AI Interconnect Signal Integrity Engineer

Tenstorrent · Semiconductors · Austin, TX +2 · Systems Engineering

Seeking a Senior High Speed Interconnect / Signal Integrity Engineer to design and validate high-bandwidth links for large-scale AI systems, focusing on interconnect solutions across copper and optical technologies for next-generation AI inference and training clusters.

What you'd actually do

  1. Define and specify high-speed interconnect architectures between systems within large AI clusters.
  2. Develop requirements, validation plans, and test strategies for passive and active copper cables and optical transceivers at 100G, 400G, 800G, and 1.6T.
  3. Document topologies, routing assumptions, and cable requirements for internal and customer-facing clusters.
  4. Perform link and channel budget analysis, including loss, jitter, eye margin, and BER considerations across PVT and aging.
  5. Lead and execute qualification and reliability testing, including accelerated life testing, mating life, and failure analysis for interconnect components.

Skills

Required

  • Bachelor’s or Master’s in Electrical Engineering
  • 5+ years working on high-speed communications (100G–1.6T)
  • Signal integrity
  • Channels
  • Links
  • Building and owning link and channel budgets
  • Making clear tradeoffs between reach, loss, BER, and margin
  • Hands-on with SI tools and lab equipment (Keysight ADS, VNAs, TDRs, BERTs, protocol analyzers)
  • Familiar with cable specification and testing
  • Accelerated life testing
  • Mating life
  • Failure analysis
  • Collaborate across hardware, systems, and manufacturing teams

Nice to have

  • Manufacturing/DFM/DTM experience

What the JD emphasized

  • high-speed communications (100G–1.6T)
  • signal integrity
  • channels
  • links
  • link and channel budgets
  • SI tools
  • lab equipment
  • Keysight ADS
  • VNAs
  • TDRs
  • BERTs
  • protocol analyzers
  • cable specification and testing
  • accelerated life testing
  • mating life
  • failure analysis
  • high-speed interconnect architectures
  • passive and active copper cables
  • optical transceivers
  • 100G
  • 400G
  • 800G
  • 1.6T
  • link and channel budget analysis
  • loss
  • jitter
  • eye margin
  • BER considerations
  • PVT
  • aging
  • qualification and reliability testing
  • interconnect components

Other signals

  • AI inference and training clusters
  • high-bandwidth links
  • large-scale AI systems