Packaging Process Engineer – Microdisplay

Snap Snap · Consumer · Chandler - 300 N 56th St

Snap is seeking a Packaging Process Engineer to own the backend packaging and continuity testing process for advanced microdisplays, from prototyping through high-volume manufacturing. The role involves driving process development, yield, and manufacturability, managing equipment and material partners, developing assembly and packaging recipes, and leading problem-solving efforts.

What you'd actually do

  1. Own and optimize a backend packaging process for LCOS advanced displays, from early development through high-volume manufacturing, ensuring stable, high-yield output.
  2. Act as the primary technical interface for equipment, materials, and manufacturing partners, overseeing tool qualification, process capability, build readiness, and issue resolution.
  3. Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.
  4. Lead structured problem solving (DOEs, FMEA, root cause analysis, corrective actions) for yield excursions, line stops, and parametric drifts.
  5. Partner with cross-functional teams to define capacity models and WIP/uptime strategies.

Skills

Required

  • BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field
  • 7+ years of experience as a process or packaging engineer in microfabrication fabs.
  • Direct experience designing and optimizing automated production equipment for semiconductors or displays
  • Direct experience in final test for semiconductor or display packages.
  • Demonstrated track record of improving yield and process stability through structured experimentation (DOE), SPC, and cross-functional problem solving.
  • Experience planning and executing process transfers from R&D to production lines.
  • Hands-on experience with automated packaging equipment, including recipe setup, tuning, and troubleshooting.
  • Proven ability to function as a module owner in a high-volume fab or OSAT environment, balancing NPI design transfer activities and roadmap work.
  • Exceptional problem solver with a structured, solution focused approach, leveraging advanced statistical tools to improve yield and stability in packaging.
  • Comfortable working in an ISO 5 cleanroom environment and enforcing best practices in contamination control, safety, and EHS compliance.

Nice to have

  • 10+ years of experience in process engineering and backend packaging.
  • Ownership of module performance and direct collaboration with applications engineers.
  • Excellent problem solver with a foundation in Six Sigma.
  • Experience with automated optical assembly and test equipment.
  • Experience developing and sustaining wire bonding processes (materials, bond parameters, loop profiles, pad design interfaces) for high‑density LOCS packages.
  • Strong expertise in backend assembly processes for advanced displays, including die attach, marking, and final packing.

What the JD emphasized

  • 7+ years of experience as a process or packaging engineer in microfabrication fabs.
  • Direct experience designing and optimizing automated production equipment for semiconductors or displays
  • Direct experience in final test for semiconductor or display packages.
  • Demonstrated track record of improving yield and process stability through structured experimentation (DOE), SPC, and cross-functional problem solving.