Soc Physical Design Verification Engineer

Tenstorrent · Semiconductors · Austin, Fort Collins +1 · Physical Design

Tenstorrent is seeking a SoC Physical Design Verification Engineer to drive full-chip signoff and ensure manufacturable, high-quality silicon across advanced technology nodes. Responsibilities include leading physical verification closure, debugging issues, and collaborating with cross-functional teams to achieve successful tapeouts.

What you'd actually do

  1. drive full-chip signoff and ensure manufacturable, high-quality silicon across advanced technology nodes
  2. lead physical verification closure (DRC, LVS, ERC, etc.)
  3. debug issues using standard industry PV tools
  4. collaborate across RTL, PD, CAD, and packaging teams to achieve successful tapeouts

Skills

Required

  • Physical Verification (DRC, LVS, ERC, PERC, Antenna, DFM)
  • Standard PV tools (Calibre, ICV, Pegasus, FC, Innovus)
  • Advanced node challenges (7nm, 5nm, 3nm)
  • FinFET design considerations
  • Scripting (Python, TCL)
  • ESD planning
  • Padring integration
  • Bump/RDL strategies
  • Reliability analysis (IR drop, EM)

Nice to have

  • CPU/IP/SoC physical verification and tapeout closure
  • Debugging complex verification flows
  • Cross-functional collaboration (RTL, PD, CAD, foundry)
  • Mentoring and technical leadership
  • Physical verification methodologies and flow optimization
  • Full-chip signoff integration and verification
  • Scalable PV methodologies and automation

What the JD emphasized

  • BS or MS in Engineering (Electrical, Electronics, or related field)
  • 7–14 years of hands-on experience in CPU/IP/SoC physical verification
  • Strong command of industry-standard tools and flows (Calibre, ICV, Pegasus, FC, Innovus, etc.)
  • Proven expertise in DRC, LVS, ERC, PERC, Antenna, and DFM verification
  • Solid understanding of advanced node challenges (7nm, 5nm, 3nm) and FinFET design considerations
  • Scripting proficiency (Python, TCL) for automation and flow optimization
  • Familiarity with ESD planning, padring integration, bump/RDL strategies, and reliability analysis (IR drop, EM)