Semiconductors · RISC-V AI chip (Jim Keller)
Currently tracking 22 active AI roles, down 23% versus the prior 4 weeks. Primary focus: Serve · Engineering. Salary range $100k–$500k (avg $300k).
| Title | Stage | AI score |
|---|---|---|
| RISC-V AI / HPC & Agentic Software Engineer This role focuses on integrating and optimizing AI/HPC software stacks on RISC-V processors, specifically leading the bring-up of a RISC-V-native agentic AI software stack including runtime orchestration and distributed execution frameworks. The engineer will work closely with hardware architects and compiler engineers to align software capabilities with RISC-V features, operating at the hardware-software boundary. | AgentServe | 7 |
| Advanced Packaging Process Engineer Tenstorrent is seeking an Advanced Packaging Process Engineer with experience in 2.5D and 3D chiplet packaging to drive advanced package technology and reliability for next-generation AI/ML products. The role involves close partnership with foundries and OSATs, owning technology implementation, acting as a technical interface, and collaborating with design and reliability teams. |
| — |
| 0 |
| Sustaining Test Engineer This role is for a Sustaining Test Engineer in Taiwan, focusing on supporting semiconductor test operations at OSAT partners. The engineer will be responsible for driving yield improvements, resolving manufacturing issues, and ensuring the successful deployment of test solutions. Key responsibilities include validating and maintaining test programs, analyzing test data, leading investigations for RMA and customer returns, and managing business continuity for test operations. The role requires hands-on ATE experience and strong debugging skills in a production environment. | — | 0 |